US 12,249,466 B2
Multilayer electronic component
Young Ghyu Ahn, Suwon-si (KR); Soo Hwan Son, Suwon-si (KR); and Young Key Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 11, 2024, as Appl. No. 18/410,196.
Application 18/410,196 is a continuation of application No. 17/845,180, filed on Jun. 21, 2022, granted, now 11,908,627.
Claims priority of application No. 10-2022-0036552 (KR), filed on Mar. 24, 2022.
Prior Publication US 2024/0145174 A1, May 2, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a plurality of dielectric layers and first and second internal electrodes alternately disposed in a first direction with the plurality of dielectric layers interposed therebetween, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface and connected to the first internal electrodes, and a first bend portion extending from the first connection portion to a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface and connected to the second internal electrodes, and a second bend portion extending from the second connection portion to a portion of the first surface;
a first insulating layer disposed on the first connection portion; and
a second insulating layer disposed on the second connection portion,
wherein the first and second connection portions are arranged to cover the first and second internal electrodes, respectively, and
the multilayer electronic component satisfies the following relationship:
Ti<Tc<T,
where T denotes an average distance of the body in the first direction,
Ti denotes an average distance, in the first direction, from the first surface to an internal electrode disposed closest to the second surface, among the first and second internal electrodes, and
Tc denotes an average distance, in the first direction, from the first surface to one ends of the first and second connection portions in the first direction.