US 12,249,464 B2
Electronic component
Shinya Onodera, Tokyo (JP); Akitoshi Yoshii, Tokyo (JP); and Kyohei Takata, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Dec. 22, 2021, as Appl. No. 17/559,552.
Claims priority of application No. 2020-219273 (JP), filed on Dec. 28, 2020.
Prior Publication US 2022/0208474 A1, Jun. 30, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic component, comprising:
an element body of a rectangular parallelepiped shape including a pair of end surfaces opposing each other in a first direction, a pair of first side surfaces opposing each other in a second direction, and a pair of second side surfaces opposing each other in a third direction;
a plurality of external electrodes disposed on both ends of the element body in the first direction;
a plurality of internal electrodes disposed in the element body to be distributed in the second direction and electrically connected to corresponding external electrodes of the plurality of external electrodes; and
an insulating film disposed on the element body,
wherein each of the plurality of external electrodes includes a pair of first electrode portions disposed on the pair of second side surfaces and including a sintered metal layer and a conductive resin layer,
the conductive resin layer covers an edge of the sintered metal layer and a portion of the second side surface, on each of the pair of second side surfaces,
each of the pair of second side surfaces includes a region exposed from the external electrodes,
the insulating film includes film portions disposed on the pair of second side surfaces, and
each of the film portions covers an edge of the conductive resin layer and a portion of the region of each of the second side surfaces that is along the edge of the conductive resin layer.