US 12,249,463 B2
Multi-terminal MLCC for improved heat dissipation
Mark R. Laps, Simpsonville, SC (US); John Bultitude, Simpsonville, SC (US); Philip M. Lessner, Simpsonville, SC (US); Lonnie G. Jones, Simpsonville, SC (US); Allen Templeton, Simpsonville, SC (US); and Nathan A. Reed, Simpsonville, SC (US)
Assigned to KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed by KEMET Electronics Corporation, Fort Lauderdale, FL (US)
Filed on Apr. 19, 2021, as Appl. No. 17/233,796.
Claims priority of provisional application 63/012,378, filed on Apr. 20, 2020.
Prior Publication US 2021/0327646 A1, Oct. 21, 2021
Int. Cl. H01G 4/258 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/38 (2006.01)
CPC H01G 4/258 (2013.01) [H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/38 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01)] 39 Claims
OG exemplary drawing
 
1. A heat dissipating electronic device comprising:
internal electrodes of opposing polarity forming a capacitive couple between external terminations wherein said internal electrodes are in coplanar pairs of opposing polarity;
a dielectric between said internal electrodes;
at least one thermal dissipation layer wherein said at least one thermal dissipation layer is between adjacent said coplanar pairs;
at least one thermal conductive terminal wherein said at least one thermal dissipation layer is in electrically conductive contact with said thermal conductive terminal and said thermal conductive terminal is not in electrical contact with said external terminations, and said thermal conductive terminal does not contribute to electrical functionality of said capacitive couple wherein said thermal conductive termination is in thermal conductive contact with a thermal dissipation trace wherein said thermal dissipation trace does not contribute to electrical functionality of said capacitive couple; and
a substrate comprising active traces and said thermal dissipation trace wherein said active traces are in electrical contact with said external terminations.