US 12,249,461 B2
Multilayer electronic component
So Jung An, Suwon-si (KR); Hyung Jong Choi, Suwon-si (KR); Yoo Jeong Lee, Suwon-si (KR); Chung Yeol Lee, Suwon-si (KR); Kwang Yeun Won, Suwon-si (KR); Woo Kyung Sung, Suwon-si (KR); Myung Jun Park, Suwon-si (KR); and Jong Ho Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 1, 2022, as Appl. No. 17/901,051.
Claims priority of application No. 10-2021-0194176 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0230770 A1, Jul. 20, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/2325 (2013.01); H01G 4/30 (2013.01)] 33 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a first portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a second portion of the first surface;
an insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion, the insulating layer includes a first silicone-based resin;
a first plating layer disposed on the first band portion and extends to an end portion of the first insulating layer disposed on the first connection portion; and
a second plating layer disposed on the second band portion and extends to an end portion of the second insulating layer disposed on the second connection portion,
wherein H1<H2, where H1 is an average distance from the first surface to an internal electrode, disposed to be closest to the first surface, among the first and second internal electrodes, in the first direction, and H2 is an average distance from an extension line of the first surface to an end of the first plating layer disposed on the first connection portion or to an end of the second plating layer disposed on the second connection portion in the first direction.