US 12,249,458 B2
Multilayer ceramic electronic component including metal terminals, exterior material, and electrostatic shielding metal
Naotaka Hasegawa, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 28, 2022, as Appl. No. 17/954,380.
Claims priority of application No. 2021-163481 (JP), filed on Oct. 4, 2021.
Prior Publication US 2023/0108549 A1, Apr. 6, 2023
Int. Cl. H01G 2/22 (2006.01); H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 2/22 (2013.01) [H01G 4/224 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a multilayer ceramic electronic component main body including a multilayer body, a first external electrode, and a second external electrode, the multilayer body including a plurality of ceramic layers and a plurality of internal conductive layers laminated on the ceramic layers, and further including a first main surface and a second main surface opposed to each other in a height direction, a first lateral surface and a second lateral surface opposed to each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal or substantially orthogonal to the height direction and the width direction, the first external electrode being provided on the first end surface side, and the second external electrode being provided on the second end surface side;
a first metal terminal connected to the first external electrode; and
a second metal terminal connected to the second external electrode;
an exterior material covering the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal; and
an electrostatic shielding metal embedded in the exterior material and covering at least a portion of the multilayer ceramic electronic component main body; wherein
the electrostatic shielding metal is provided between a surface of the exterior material and a surface of the multilayer ceramic electronic component main body, and is provided at a position spaced away from the multilayer ceramic electronic component main body; and
a dimension in the length direction of the electrostatic shielding metal is longer than a dimension in the length direction of a portion exposed from the first external electrode and the second external electrode.