US 12,249,448 B2
Resistor and manufacturing method of resistor
Kohji Eto, Nagano (JP); Yohei Tokiwa, Nagano (JP); Reina Kaneko, Nagano (JP); and Jumpei Yamamoto, Nagano (JP)
Assigned to KOA Corporation, Nagano (JP)
Appl. No. 17/759,506
Filed by KOA Corporation, Nagano (JP)
PCT Filed Dec. 28, 2020, PCT No. PCT/JP2020/049195
§ 371(c)(1), (2) Date Jul. 26, 2022,
PCT Pub. No. WO2021/153152, PCT Pub. Date Aug. 5, 2021.
Claims priority of application No. 2020-011196 (JP), filed on Jan. 27, 2020.
Prior Publication US 2023/0040165 A1, Feb. 9, 2023
Int. Cl. H01C 17/242 (2006.01); H01C 1/034 (2006.01); H01C 1/144 (2006.01); H01C 17/28 (2006.01)
CPC H01C 17/242 (2013.01) [H01C 1/034 (2013.01); H01C 1/144 (2013.01); H01C 17/28 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A resistor comprising a resistance body and a pair of electrodes connected to the resistance body, the resistance body being arranged so as to be at least separated away from a substrate board when mounted on the substrate board, wherein
the resistance body and each of the electrodes are directly bonded with each other, and
the resistor has an oxide film due to oxidation of the resistance body or the electrode on at least one surface of the resistance body and each of the electrodes at a boundary portion between the resistance body and each of the electrodes on a mounting surface of the resistor.