US 12,249,287 B2
Electronic device
Kuan-Feng Lee, Miao-Li County (TW); and Yuan-Lin Wu, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Feb. 15, 2024, as Appl. No. 18/442,199.
Application 18/442,199 is a continuation of application No. 18/155,336, filed on Jan. 17, 2023, granted, now 11,935,487.
Application 18/155,336 is a continuation of application No. 17/524,122, filed on Nov. 11, 2021, granted, now 11,580,912, issued on Feb. 14, 2023.
Application 17/524,122 is a continuation of application No. 16/950,035, filed on Nov. 17, 2020, granted, now 11,195,470, issued on Dec. 7, 2021.
Application 16/950,035 is a continuation of application No. 16/702,157, filed on Dec. 3, 2019, granted, now 10,872,908, issued on Dec. 22, 2020.
Application 16/702,157 is a continuation of application No. 15/909,097, filed on Mar. 1, 2018, granted, now 10,529,745, issued on Jan. 7, 2020.
Application 15/909,097 is a continuation in part of application No. 15/640,647, filed on Jul. 3, 2017, granted, now 10,217,416, issued on Feb. 26, 2019.
Application 15/909,097 is a continuation in part of application No. 15/451,432, filed on Mar. 7, 2017, abandoned.
Claims priority of provisional application 62/371,252, filed on Aug. 5, 2016.
Claims priority of provisional application 62/358,177, filed on Jul. 5, 2016.
Claims priority of application No. 201710067676.6 (CN), filed on Feb. 7, 2017; and application No. 201710660574.5 (CN), filed on Aug. 4, 2017.
Prior Publication US 2024/0221679 A1, Jul. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G09G 3/3266 (2016.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H01L 23/544 (2006.01); H01L 27/12 (2006.01)
CPC G09G 3/3266 (2013.01) [G06F 3/0412 (2013.01); G06F 3/04164 (2019.05); G06F 3/044 (2013.01); H01L 23/544 (2013.01); H01L 27/1225 (2013.01); H01L 27/124 (2013.01); H01L 27/1251 (2013.01); G09G 2310/0297 (2013.01); H01L 2223/54426 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an insulating layer;
a first conductive portion and a second conductive portion, wherein the first conductive portion and the second conductive portion are respectively corresponding to opposite sides of the insulating layer;
a connective portion at least partially disposed in the insulating layer, wherein the first conductive portion is electrically connected to the second conductive portion through the connective portion; and
a processing unit and an electronic element, wherein the processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer,
wherein the processing unit and the electronic element are overlapped with the connective portion, and
wherein a thickness of the processing unit is greater than a thickness of the first conductive portion.