CPC G06K 19/0772 (2013.01) | 19 Claims |
1. A module for integrating into a card body of a smart card, the module comprising:
a support;
a contact portion formed on a first surface of the support; and
a solder material formed on the contact portion,
wherein a surface of the solder material is at least partially covered by a flux,
wherein the flux is formed of flux residuals provided on a surface portion of the solder material.
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