US 12,248,679 B1
Multi-chip module (MCM) with multi-port unified memory
Ramin Farjadrad, Los Altos, CA (US); and Syrus Ziai, Los Altos, CA (US)
Assigned to Eliyan Corporation, Santa Clara, CA (US)
Filed by Eliyan Corporation, Santa Clara, CA (US)
Filed on Jan. 21, 2024, as Appl. No. 18/418,293.
Application 18/418,293 is a continuation of application No. 17/994,123, filed on Nov. 25, 2022, granted, now 11,893,242.
Claims priority of provisional application 63/283,265, filed on Nov. 25, 2021.
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0611 (2013.01) [G06F 3/0629 (2013.01); G06F 3/0673 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A chiplet-based multi-chip module (MCM) to mount to a base substrate, the chiplet-based MCM comprising:
a package substrate that is separate from the base substrate;
a first integrated circuit (IC) chiplet coupled to the package substrate and comprising a first memory interface;
a second IC chiplet coupled to the package substrate and comprising a second memory interface; and
a first memory chiplet coupled to the package substrate and comprising
memory comprising a memory space;
a first port coupled to the memory to access any portion of the memory space, the first port to communicate with the first memory interface of the first IC chiplet;
a second port coupled to the memory to access any portion of the memory space, the second port to communicate with the second memory interface of the second IC chiplet; and
in-memory processing circuitry coupled to the memory to control transactions between the first memory chiplet, the first IC chiplet, and the second IC chiplet.