US 12,248,271 B2
Coupling method
Toshiro Usui, Ibaraki (JP); and Takahiro Kobayashi, Chiba (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 7, 2023, as Appl. No. 18/503,231.
Application 18/503,231 is a continuation of application No. 17/941,457, filed on Sep. 9, 2022, granted, now 11,841,667.
Claims priority of application No. 2021-151978 (JP), filed on Sep. 17, 2021.
Prior Publication US 2024/0077827 A1, Mar. 7, 2024
Int. Cl. G03G 15/00 (2006.01)
CPC G03G 15/80 (2013.01) 8 Claims
OG exemplary drawing
 
1. A coupling method for manufacturing an image forming apparatus configured to form an image on a recording material based on an image information, comprising:
preparing a first member having a first conductive portion;
preparing a second member including a sheet metal having a metal layer and an insulative layer provided on a surface of the metal layer;
conducting a press working for the second member to form a second conductive portion in the second member, wherein the press working removes the insulative layer of the second member so that a part of the metal layer of the second member is exposed and becomes the second conductive portion; and
coupling the first member and the second member in a state in which at least a part of the first conductive portion and at least a part of the second conductive portion are contacted with each other.