US 12,248,266 B2
Conductive sheet and sheet bundle package
Takashi Tomiyama, Sunto Shizuoka (JP); and Sadatoshi Oishi, Fuji Shizuoka (JP)
Assigned to TOSHIBA TEC KABUSHIKI KAISHA, Tokyo (JP)
Filed by TOSHIBA TEC KABUSHIKI KAISHA, Tokyo (JP)
Filed on Sep. 18, 2023, as Appl. No. 18/469,281.
Application 18/469,281 is a continuation of application No. 17/888,707, filed on Aug. 16, 2022, granted, now 11,796,950.
Claims priority of application No. 2021-178653 (JP), filed on Nov. 1, 2021.
Prior Publication US 2024/0004336 A1, Jan. 4, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G03G 15/00 (2006.01); H04N 1/32 (2006.01)
CPC G03G 15/5062 (2013.01) [H04N 1/32138 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A conductive sheet that is configured to be stacked between a sheet tray of an image forming device and a sheet, the conductive sheet comprising:
a base layer comprising a conductive material, the base layer configured to be stacked between the sheet tray and the sheet so that the conductive material overlaps with a wireless tag of the sheet; and
a regulator configured to regulate conveyance of the conductive sheet by the image forming device when the conductive sheet is stacked between the sheet tray and the sheet so that the conductive material overlaps with the wireless tag of the sheet.