US 12,248,245 B2
Structure and method of reticle pod having inspection window
Wang Cheng Shih, Hsinchu (TW); Hao-Ming Chang, Pingtung (TW); Chung-Yang Huang, Chiayi County (TW); and Cheng-Ming Lin, Yunlin County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Jul. 30, 2023, as Appl. No. 18/361,898.
Application 18/361,898 is a continuation of application No. 17/728,734, filed on Apr. 25, 2022, granted, now 11,796,909.
Application 17/728,734 is a continuation of application No. 16/732,204, filed on Dec. 31, 2019, granted, now 11,314,164, issued on Apr. 26, 2022.
Prior Publication US 2023/0367207 A1, Nov. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 1/84 (2012.01); G03F 1/66 (2012.01); G03F 1/72 (2012.01)
CPC G03F 1/84 (2013.01) [G03F 1/66 (2013.01); G03F 1/72 (2013.01)] 20 Claims
 
1. A method comprising:
inspecting a reticle in a reticle pod, the reticle pod including a sealed space to accommodate the reticle, and the reticle pod further comprising a window arranged on an upper surface of the reticle pod, wherein the inspecting is performed through the window; and
moving the reticle out of the reticle pod for performing a lithography operation using the reticle.