US 12,248,188 B2
Semiconductor device
Kazuya Ohira, Nerima (JP); and Hideto Furuyama, Yokohama (JP)
Assigned to KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed on Aug. 23, 2022, as Appl. No. 17/821,584.
Claims priority of application No. 2022-036874 (JP), filed on Mar. 10, 2022.
Prior Publication US 2023/0288651 A1, Sep. 14, 2023
Int. Cl. G02B 6/42 (2006.01)
CPC G02B 6/4206 (2013.01) [G02B 6/4245 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a holding member located on the substrate, the holding member including a module placement part and an opening arranged in a first direction;
an optical module located in the module placement part and mounted on the substrate; and
an optical fiber passing through the opening, the optical fiber being connected with the optical module,
the holding member including a first corner part and a second corner part, the first corner part and the second corner part facing the optical fiber at the opening,
the opening being between the first corner part and the second corner part in a direction crossing the first direction, and
the first corner part and the second corner part being beveled.