US 12,248,173 B2
Optical module
Chung-Hsin Fu, Taipei (TW); Min-Sheng Kao, Taipei (TW); ChunFu Wu, Dongguan (CN); Yi-Tseng Lin, Taipei (TW); Chih-Wei Yu, Taipei (TW); Chien-Tzu Wu, Taipei (TW); QianBing Yan, Dongguan (CN); and Yueh-Kuo Lin, Taipei (TW)
Assigned to DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD, Dongguan (CN)
Filed by Dongguan Luxshare Technologies Co., Ltd, Dongguan (CN)
Filed on Dec. 22, 2022, as Appl. No. 18/087,492.
Claims priority of application No. 202210401987.2 (CN), filed on Apr. 18, 2022.
Prior Publication US 2023/0333317 A1, Oct. 19, 2023
Int. Cl. G02B 6/12 (2006.01); H01S 3/00 (2006.01); H01S 3/02 (2006.01); H01S 3/04 (2006.01)
CPC G02B 6/12004 (2013.01) [H01S 3/0071 (2013.01); H01S 3/025 (2013.01); H01S 3/0405 (2013.01); G02B 2006/12102 (2013.01); G02B 2006/12104 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/1213 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a lower housing;
an upper housing covering the lower housing;
a first metal base disposed on a side of the upper housing facing the lower housing;
a second metal base disposed on a side of the lower housing facing the upper housing;
a circuit board disposed on the second metal base and provided with a hollow region to make part of the second metal base exposed from the hollow region;
a silicon photonic chip disposed on the second metal base exposed from the hollow region, electrically connected to the circuit board, and configured to output a first optical signal or receive a second optical signal; and
a light emission module comprising:
a laser chip disposed on the first metal base and configured to emit a third optical signal; and
an optical path assembly disposed on the first metal base and/or on the second metal base exposed from the hollow region, and configured to guide the third optical signal emitted by the laser chip to the silicon photonic chip.