CPC G01R 31/2856 (2013.01) [G01R 31/3004 (2013.01); H03K 3/011 (2013.01); H03K 3/0315 (2013.01)] | 17 Claims |
1. A semiconductor chip comprising:
a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied;
a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch; and
a second ring oscillator separated from the first ring oscillator and connected to the first node through a second supply switch and the second node through a second ground switch,
wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator,
wherein when the semiconductor device and the first ring oscillator operate on the basis of a first voltage applied to the first and second nodes, a signal is output from the first ring oscillator that has a first frequency and the semiconductor chip is configured to output a first data including the first voltage and a first current that flows through the semiconductor device and the first ring oscillator, and
when the semiconductor device, the first ring oscillator and the second ring oscillator operate on the basis of a second voltage applied to the first and second nodes, a signal is output from the second ring oscillator that has a second frequency and the semiconductor chip is configured to output a second data including the second voltage and a second current that flows through the semiconductor device, the first ring oscillator, and the second ring oscillator.
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