US 12,248,012 B2
Method for producing a probe used for testing integrated electronic circuits
Alberto Pagani, Nova Milanese (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Sep. 22, 2023, as Appl. No. 18/371,823.
Application 18/371,823 is a division of application No. 17/496,154, filed on Oct. 7, 2021, granted, now 11,796,568.
Application 17/496,154 is a division of application No. 16/130,536, filed on Sep. 13, 2018, granted, now 11,169,180, issued on Nov. 9, 2021.
Application 16/130,536 is a division of application No. 14/950,171, filed on Nov. 24, 2015, granted, now 10,107,837, issued on Oct. 23, 2018.
Application 14/950,171 is a division of application No. 13/106,615, filed on May 12, 2011, granted, now 9,229,031, issued on Jan. 5, 2016.
Claims priority of application No. MI2010A000844 (IT), filed on May 12, 2010.
Prior Publication US 2024/0012029 A1, Jan. 11, 2024
Int. Cl. H01F 7/06 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 3/00 (2006.01); G01R 31/319 (2006.01)
CPC G01R 3/00 (2013.01) [G01R 1/06761 (2013.01); G01R 1/07342 (2013.01); G01R 31/31905 (2013.01); G01R 1/07307 (2013.01); Y10T 29/49002 (2015.01)] 14 Claims
OG exemplary drawing
 
1. A method for producing a probe, comprising:
forming a probe body made of an electrically conductive material;
covering sides and an end of the probe body with a protection layer;
removing the protection layer at the end of the probe body and planarizing the probe body at said end to form an active end that is not covered by said protection layer;
forming on said active end of the probe body an electrically conductive contact region having a first hardness value equal to or greater than 300 HV; and
removing the protection layer from the sides of the probe body.