US 12,248,001 B2
Lidless BGA socket apparatus for testing semiconductor device
Dong Weon Hwang, Gyeonggi-do (KR); Logan Jae Hwang, Flower Mound, TX (US); and Jae Baek Hwang, Seoul (KR)
Assigned to HICON CO., LTD., Seongnam-si (KR); Dong Hwang, Seongnarn-si (KR); Hwang Jae, Flower Mound, TX (US); and Hwang Baek, Seoul (KR)
Appl. No. 17/441,512
Filed by HICON CO., LTD., Gyeonggi-do (KR); Dong Weon Hwang, Gyeonggi-do (KR); Logan Jae Hwang, Flower Mound, TX (US); and Jae Baek Hwang, Seoul (KR)
PCT Filed Apr. 15, 2019, PCT No. PCT/KR2019/004494
§ 371(c)(1), (2) Date Sep. 21, 2021,
PCT Pub. No. WO2020/204245, PCT Pub. Date Oct. 8, 2020.
Claims priority of application No. 10-2019-0039833 (KR), filed on Apr. 4, 2019.
Prior Publication US 2022/0163561 A1, May 26, 2022
Int. Cl. G01R 1/04 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); H01R 13/629 (2006.01)
CPC G01R 1/0483 (2013.01) [G01R 1/07314 (2013.01); G01R 31/2886 (2013.01); H01R 13/62905 (2013.01); H01R 2201/20 (2013.01)] 30 Claims
OG exemplary drawing
 
1. A lidless BGA socket device for testing a BGA IC, the lidless BGA socket device comprising:
a contact having an elastic force exerted in a lateral direction and including an upper tip, the contact coming into electrical contact with each solder ball of the IC;
a main body including a slider receiving portion depressed in a horizontal upper surface thereof for seating the IC, and a cam supporting portion formed in the upper surface at a location corresponding to a peripheral portion of the slider receiving portion to define an end inner surface, the main body being configured such that the contact is fixed to a lower surface of the slider receiving portion;
a slider enabling forward and backward sliding in a horizontal direction in the slider receiving portion, and including a cam contact portion provided at an end thereof while facing the cam supporting portion such that the forward and backward sliding is performed in response to a lateral operating force applied to the cam contact portion, the slider transmitting the lateral operating force to the contact in accordance with forward and backward sliding positions thereof to allow the solder ball of the IC and the contact to come into contact with each other;
a contact force generating spring provided between the main body and the slider, and elastically supporting the slider in a moving direction to provide a contact force between the contact and the solder ball of the IC; and
wherein uppermost ends of the main body and the slider are lower than at least a height of the loaded IC.