US 12,247,769 B2
Vapor injection module and heat pump system using same
Seong Hun Kim, Daejeon (KR); Hae Jun Lee, Daejeon (KR); and Sung Je Lee, Daejeon (KR)
Assigned to HANON SYSTEMS, Daejeon (KR)
Appl. No. 17/793,484
Filed by Hanon Systems, Daejeon (KR)
PCT Filed Jan. 14, 2021, PCT No. PCT/KR2021/000519
§ 371(c)(1), (2) Date Jul. 18, 2022,
PCT Pub. No. WO2021/172752, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 10-2020-0025013 (KR), filed on Feb. 28, 2020.
Prior Publication US 2023/0073993 A1, Mar. 9, 2023
Int. Cl. F25B 41/385 (2021.01); F25B 43/00 (2006.01)
CPC F25B 41/385 (2021.01) [F25B 43/006 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A vapor injection module comprising:
a first expansion valve having an inlet port into which a refrigerant is introduced, and first line and second line connected to the inlet port so that the introduced refrigerant flows therethrough, the first expansion valve being disposed at a connection portion between the first line and the second line and configured to control a flow direction of the refrigerant and whether to expand the refrigerant depending on an air conditioning mode;
a gas-liquid separator connected to the first line and configured to separate the introduced refrigerant into a liquid refrigerant and a gaseous refrigerant;
a second expansion valve connected to a movement passage through which the liquid refrigerant separated in the gas-liquid separator flows, the second expansion valve being configured to expand the introduced refrigerant; and
a first outlet port connected to the second line and the second expansion valve,
wherein the first expansion valve comprises a single ball valve configured to rotate and disposed at a center at which the inlet port, the first line, and the second line are connected.