US 12,247,311 B2
Plating apparatus and plating process method
Shao Hua Chang, Tokyo (JP); Yasuyuki Masuda, Tokyo (JP); and Masaya Seki, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/624,034
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Dec. 8, 2020, PCT No. PCT/JP2020/045625
§ 371(c)(1), (2) Date Dec. 30, 2021,
PCT Pub. No. WO2022/123648, PCT Pub. Date Jun. 16, 2022.
Prior Publication US 2022/0356595 A1, Nov. 10, 2022
Int. Cl. C25D 17/00 (2006.01); C25D 5/02 (2006.01); C25D 17/02 (2006.01); C25D 17/08 (2006.01); C25D 17/10 (2006.01); C25D 17/12 (2006.01); C25D 21/04 (2006.01); C25D 21/12 (2006.01); C25D 5/04 (2006.01)
CPC C25D 17/02 (2013.01) [C25D 5/022 (2013.01); C25D 17/001 (2013.01); C25D 17/002 (2013.01); C25D 17/008 (2013.01); C25D 17/08 (2013.01); C25D 17/10 (2013.01); C25D 17/12 (2013.01); C25D 21/04 (2013.01); C25D 21/12 (2013.01); C25D 5/04 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank that includes a membrane arranged inside the plating tank, and an anode that has a cylindrical shape extending in a vertical direction and is arranged in an anode chamber partitioned below the membrane;
a substrate holder arranged above the anode chamber and configured to hold a substrate as a cathode,
a gas accumulation portion disposed in the anode chamber so as to have a space between the anode and the gas accumulation portion, the gas accumulation portion covering an upper end, an outer peripheral surface, and an inner peripheral surface of the anode to accumulate a process gas generated from the anode;
a discharge mechanism configured to discharge the process gas accumulated in the gas accumulation portion to outside of the plating tank;
an anode mask arranged in the anode chamber and having an opening portion through which electricity is allowed to flow between the anode and the substrate; and
an anode moving mechanism that moves the anode in a vertical direction.