US 12,247,300 B2
Cleaning solution and cleaning method
Kohei Hayashi, Shizuoka (JP); and Tetsuya Kamimura, Shizuoka (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on May 19, 2022, as Appl. No. 17/748,536.
Application 17/748,536 is a continuation of application No. PCT/JP2020/038427, filed on Oct. 12, 2020.
Claims priority of application No. 2019-211197 (JP), filed on Nov. 22, 2019; and application No. 2020-118353 (JP), filed on Jul. 9, 2020.
Prior Publication US 2022/0275519 A1, Sep. 1, 2022
Int. Cl. C11D 1/75 (2006.01); C11D 1/18 (2006.01); C11D 3/04 (2006.01); C11D 3/26 (2006.01); C11D 3/28 (2006.01); C11D 3/30 (2006.01); C11D 3/33 (2006.01); C11D 3/36 (2006.01); C23G 1/14 (2006.01)
CPC C23G 1/14 (2013.01) [C11D 1/18 (2013.01); C11D 1/75 (2013.01); C11D 3/042 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); C11D 3/33 (2013.01); C11D 3/361 (2013.01)] 20 Claims
 
1. A cleaning liquid for semiconductor substrates having undergone a chemical mechanical polishing process, the cleaning liquid comprising:
an amine oxide compound that is a compound represented by Formula (2), or its salt; and
at least one hydroxylamine compound selected from the group consisting of a hydroxylamine, a hydroxylamine derivative, and their salts,
wherein a content of the amine oxide compound is 0.00001 to 0.15 mass % based on a total mass of the cleaning liquid:

OG Complex Work Unit Chemistry
where R3, R4 and R5 each independently represent an alkyl group having 1 to 6 carbon atoms, and two of R3, R4 and R5 may be bonded together to form a five- or six-membered nitrogen-containing non-aromatic ring that may have an alkyl group having 1 to 4 carbon atoms.