US 12,247,290 B2
Flow control method using plasma system
Suncheul Kim, Suwon-si (KR); Donghyun Lee, Suwon-si (KR); Uihyoung Lee, Suwon-si (KR); and Donghoon Han, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 16, 2023, as Appl. No. 18/197,919.
Claims priority of application No. 10-2022-0089688 (KR), filed on Jul. 20, 2022.
Prior Publication US 2024/0026539 A1, Jan. 25, 2024
Int. Cl. C23C 16/52 (2006.01); C23C 16/448 (2006.01); C23C 16/505 (2006.01)
CPC C23C 16/52 (2013.01) [C23C 16/4486 (2013.01); C23C 16/505 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flow rate control method comprising:
supplying a fluid from a valve to a first sensor;
measuring, by the first sensor, a first temperature of the fluid, and heating the fluid;
measuring, by a second sensor, a second temperature of the heated fluid, and determining, by a controller, a first flow rate of the fluid based on comparison between the first temperature and the second temperature;
supplying the fluid to a chamber and supplying an ignition voltage to the chamber through a radio frequency (RF) power source;
measuring, by a third sensor, the ignition voltage;
comparing, by the controller, the ignition voltage and a reference voltage to determine a second flow rate of the fluid; and
controlling a supply of the fluid from the valve based on at least one of the first flow rate and or the second flow rate.