CPC C23C 14/0036 (2013.01) [C23C 14/083 (2013.01); C23C 14/086 (2013.01); C23C 18/1208 (2013.01); C23C 18/1295 (2013.01); C23C 28/345 (2013.01); C25B 1/04 (2013.01); C25B 1/55 (2021.01); C25B 11/091 (2021.01); C25D 3/562 (2013.01); C25D 5/011 (2020.08)] | 17 Claims |
1. A method for coating a substrate with a Co-Pi modified BiVO4/WO3 heterostructure film, comprising:
direct current reactive sputtering tungsten (W) onto a substrate in a gaseous mixture comprising oxygen to form a tungsten trioxide (WO3) film on the substrate;
direct current reactive sputtering bismuth (Bi) onto the tungsten trioxide (WO3) film in a gaseous mixture comprising oxygen to form a dibismuth trioxide (Bi2O3) film on the WO3 film;
drop-casting a vanadyl acetylacetonate solution onto the Bi2O3 film and heating at a temperature of at least 450° C. in ambient air to convert the Bi2O3 film to a BiVO4 film;
wherein the BiVO4 film is a porous film comprising crystalline BiVO4;
immersing the BiVO4 film on the substrate in an aqueous mixture containing a cobalt salt and a phosphate salt;
photoelectrochemically coating the BiVO4 film with a cobalt-phosphate (Co-Pi) to form a modified film on the surface of the substrate.
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