US 12,247,270 B2
Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses
Kunihiko Akai, Tokyo (JP); Yoshinori Ejiri, Tokyo (JP); Yuuhei Okada, Tokyo (JP); Toshimitsu Moriya, Tokyo (JP); Shinichirou Sukata, Tokyo (JP); and Masayuki Miyaji, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/255,980
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Jun. 26, 2019, PCT No. PCT/JP2019/025496
§ 371(c)(1), (2) Date Dec. 23, 2020,
PCT Pub. No. WO2020/004510, PCT Pub. Date Jan. 2, 2020.
Claims priority of application No. 2018-121088 (JP), filed on Jun. 26, 2018; and application No. 2019-014850 (JP), filed on Jan. 30, 2019.
Prior Publication US 2021/0114147 A1, Apr. 22, 2021
Int. Cl. C22C 13/02 (2006.01); B22F 1/00 (2022.01); B22F 1/102 (2022.01); B23K 35/26 (2006.01); C22C 28/00 (2006.01); H01B 1/22 (2006.01)
CPC C22C 13/02 (2013.01) [B22F 1/00 (2013.01); B22F 1/102 (2022.01); B23K 35/262 (2013.01); C22C 28/00 (2013.01); H01B 1/22 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for producing an anisotropic conductive film, comprising:
a preparation step in which a base material having a plurality of recesses and powdery solder fine particles are prepared;
an accommodation step in which at least some of the powdery solder fine particles are accommodated in the recesses;
a fusing step in which some of the powdery solder fine particles accommodated in the recesses are fused and the solder particles are formed inside the recesses;
a transfer step in which an insulating resin material is brought into contact with an opening side of the recesses of the base material in which the solder particles are accommodated in the recesses and a first resin layer to which the solder particles are transferred is obtained; and
a layering step in which a second resin layer formed of an insulating resin material is formed on a surface of the first resin layer on the side to which the solder particles are transferred and thereby the anisotropic conductive film is obtained.