| CPC C09J 163/00 (2013.01) [C08G 59/022 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 2301/50 (2020.08)] | 3 Claims |
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1. A two-stage epoxy bonding oil consisting of a main agent A and a curing agent B in a weight ratio of 1:1 to 3:1,
wherein the curing agent B consists of 80 to 90 parts of a linear bifunctional secondary amine curing agent, 10 to 20 parts of a high-melting-point latent curing agent and 1 to 3 parts of an anti-settling agent,
wherein the linear bifunctional secondary amine curing agent is prepared by grafting a bifunctional primary amine curing agent with a monoepoxy compound,
wherein the bifunctional primary amine curing agent is selected from the group consisting of hexamethylenediamine, decanediamine, and amino-terminated polyethers,
wherein the two-stage epoxy bonding oil is prepared by a method consisting of the following steps:
S1: adding 1 part (molar mass) of the bifunctional primary amine curing agent into the reactor and raising the temperature to 80° C., and slowly adding 2 parts (molar mass) of the monoepoxy compound dropwise into the reactor, followed by stirring for reaction, whereby the linear bifunctional secondary amine curing agent is obtained;
S2: adding 1 to 5 parts (molar mass) of hydrazine hydrate into the reactor and raising the temperature to 70° C., slowly adding 1 parts of 50% concentration isopropanol solution of an organic acid ester into the reactor dropwise, then adding an appropriate amount of xylene into the reactor and distilling the azeotrope of xylene, water, hydrazine hydrate and alcohol under vacuum conditions, whereby an organic acid hydrazide, namely, a high-melting-point latent curing agent is obtained;
S3: weighing 80 parts (molar mass) of a linear phenolic polyglycidyl ether, 10-20 parts (molar mass) of a monofunctional reactive diluent and 1-3 parts (molar mass) of an epoxy silane coupling agent, and stirring the same for 60 minutes at 60° C., whereby a main agent A is obtained;
S4: weighing the linear bifunctional secondary amine curing agent, the high-melting-point latent curing agent and the anti-settling agent, and stirring the same for 60 minutes at 50° C., whereby a curing agent B is obtained; and
S5: stirring and mixing the main agent A and the curing agent B, whereby the two-stage epoxy bonding oil is obtained,
wherein the monoepoxy compound is butyl glycidyl ether,
wherein the organic acid hydrazide has a melting point between 100° C. and 180° C. and is obtained through a hydrothermal reaction of an organic ester and hydrazine hydrate,
wherein the organic acid ester is selected from the group consisting of dimethyl malonate, diethyl succinate, ethyl benzoate, and methyl salicylate,
wherein the anti-settling agent is selected from the group consisting of hydrophobic fumed silica R974 and modified bentonite,
wherein the linear phenolic polyglycidyl ether is selected from the group consisting of phenol novolac epoxy resin, o-cresol epoxy resin and bisphenol F epoxy resin,
wherein the monofunctional reactive diluent is benzyl glycidyl ether, and
wherein the epoxy silane coupling agent is selected from the group consisting of 3-glycidoxypropyltrimethoxysilane (SCA-E87M), 3-glycidoxpropyltriethoxysilane (SCA-E87E), 3-glycidoxypropylmethyldimethoxysilane (SCA-E87F), and 2-(3,4-epoxycyclohexyl)ethyl]trimethoxysilane (SCA-E86M).
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