US 12,247,104 B2
Polyamic acid resin, polyimide resin, and resin composition including these
Kenta Sugawara, Tokyo (JP); Ryutaro Tanaka, Tokyo (JP); and Shigeo Hayashimoto, Tokyo (JP)
Assigned to Nippon Kayaku Kabushiki Kaisha, Tokyo (JP)
Appl. No. 17/437,894
Filed by Nippon Kayaku Kabushiki Kaisha, Tokyo (JP)
PCT Filed Mar. 7, 2020, PCT No. PCT/JP2020/009894
§ 371(c)(1), (2) Date Sep. 10, 2021,
PCT Pub. No. WO2020/189354, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 2019-047862 (JP), filed on Mar. 15, 2019.
Prior Publication US 2022/0169791 A1, Jun. 2, 2022
Int. Cl. C08G 73/10 (2006.01); C08L 79/08 (2006.01)
CPC C08G 73/1067 (2013.01) [C08G 73/10 (2013.01); C08G 73/1042 (2013.01); C08L 79/08 (2013.01)] 11 Claims
 
1. A polyimide resin which is an imidization compound of a polyamic acid resin which is a reaction product of an amino phenol compound (a) selected from a group consisting of 3,3′-diamino-4,4′-dihydroxydiphenylsulfone and 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane, at least one of an aliphatic diamino compound (b) comprising a dimer diamine, a tetrabasic acid dianhydride (c) comprising a compound of a following formula (6):

OG Complex Work Unit Chemistry
wherein in formula (6) Y represents a bivalent connection group represented by-C(CF3)2-,-SO2-,-CO-or following formula (2):

OG Complex Work Unit Chemistry
an oxygen atom, or a direct bond, and an aromatic diamino compound (d),
wherein the polyamic acid resin has an amino group at both ends thereof,
wherein a phenolic hydroxy group equivalent of the polyimide resin is in the range from 1,500 to 25,000 g/eq., and
wherein an amount of the aliphatic diamino compound (b) is within a range from 10 to 50% of mass of the polyimide resin.