US 12,246,663 B2
Door wiring module
Koji Yamaguchi, Osaka (JP); and Housei Mizuno, Osaka (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/029,129
Filed by AutoNetworks Technologies, Ltd., Mie (JP); Sumitomo Wiring Systems, Ltd., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Oct. 5, 2021, PCT No. PCT/JP2021/036811
§ 371(c)(1), (2) Date Mar. 29, 2023,
PCT Pub. No. WO2022/085435, PCT Pub. Date Apr. 28, 2022.
Claims priority of application No. 2020-175392 (JP), filed on Oct. 19, 2020.
Prior Publication US 2023/0365080 A1, Nov. 16, 2023
Int. Cl. B60R 16/027 (2006.01); B60J 5/04 (2006.01); B60R 16/02 (2006.01); H01B 7/08 (2006.01)
CPC B60R 16/027 (2013.01) [B60J 5/0413 (2013.01); B60R 16/0222 (2013.01); H01B 7/08 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A door wiring module assembled to a vehicle door panel including an outer panel and an inner panel, comprising:
a first service hole cover covering a first service hole formed in the inner panel;
a second service hole cover covering a second service hole formed in the inner panel; and
a plurality of wiring members, wherein
the plurality of wiring members include:
a first wiring member held by the first service hole cover to be directed to a first door apparatus; and
a second wiring member held by the second service hole cover to be directed to a second door apparatus, and
the plurality of wiring members include a connection route portion connecting the first service hole cover and the second service hole cover, and being bendable.