US 12,246,404 B2
Device maintenance in semiconductor manufacturing environment
Vincent Chien, New Taipei (TW); Shih Yi-Cheng, Zhubei (TW); and Hill Liao, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu (TW)
Filed on Nov. 22, 2023, as Appl. No. 18/517,239.
Application 18/517,239 is a division of application No. 17/873,268, filed on Jul. 26, 2022, granted, now 11,850,692.
Application 17/873,268 is a division of application No. 16/415,097, filed on May 17, 2019, granted, now 11,819,965, issued on Nov. 21, 2023.
Prior Publication US 2024/0082964 A1, Mar. 14, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/67 (2006.01); B08B 5/04 (2006.01); B08B 13/00 (2006.01); B23P 6/00 (2006.01); H01L 21/677 (2006.01); B08B 3/02 (2006.01); B08B 5/02 (2006.01)
CPC B23P 6/00 (2013.01) [B08B 5/043 (2013.01); B08B 13/00 (2013.01); H01L 21/67155 (2013.01); H01L 21/67703 (2013.01); H01L 21/67724 (2013.01); H01L 21/67745 (2013.01); B08B 3/02 (2013.01); B08B 5/02 (2013.01); B08B 5/04 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a carrier configured to carry a semiconductor wafer;
a device configured to selectively engage the carrier;
a track configured to receive the device, wherein the track extends between a first processing station and a second processing station within a semiconductor manufacturing environment to enable transport of the semiconductor wafer, via the carrier engaged with the device, between the first processing station and the second processing station;
a controller configured to determine a distance traveled by the device along the track;
a sidetrack coupled to the track;
a first transfer component, in communication with the controller, and configured to transfer the device from the track to the sidetrack responsive to the controller indicating that the distance traveled by the device exceeds a distance threshold; and
a repair component disposed along the sidetrack and configured to repair the device upon the device being transferred from the track to the sidetrack.