US 12,246,398 B2
Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump
Kunihiko Akai, Tokyo (JP); Masayuki Miyaji, Tokyo (JP); Junichi Kakehata, Tokyo (JP); and Yoshinori Ejiri, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/788,527
Filed by SHOWA DENKO MATERIALS CO., LTD., Tokyo (JP)
PCT Filed Dec. 15, 2020, PCT No. PCT/JP2020/046763
§ 371(c)(1), (2) Date Jun. 23, 2022,
PCT Pub. No. WO2021/131905, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-238418 (JP), filed on Dec. 27, 2019.
Prior Publication US 2023/0042727 A1, Feb. 9, 2023
Int. Cl. B23K 3/00 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 101/36 (2006.01)
CPC B23K 3/087 (2013.01) [B23K 1/0016 (2013.01); B23K 2101/36 (2018.08)] 8 Claims
OG exemplary drawing
 
1. A solder bump forming member comprising:
a base substrate having a plurality of recesses; and
a plurality of solder particles in the recesses, respectively, wherein;
each of the solder particles has an average particle diameter of 1 to 35 μm and a C.V value of 20% or less;
a part of each of the solder particles projects from the respective recess; and
each of the solder particles includes a planar portion in contact with a bottom portion of the respective recess.