US 12,246,382 B2
Additive manufacturing apparatus
Shigeru Takushima, Tokyo (JP); Hiroyuki Kawano, Tokyo (JP); Yoshitsugu Sawa, Tokyo (JP); and Daiji Morita, Tokyo (JP)
Assigned to MITSUBISHI ELECTRIC CORPORATION, Tokyo (JP)
Appl. No. 17/285,910
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Nov. 9, 2018, PCT No. PCT/JP2018/041751
§ 371(c)(1), (2) Date Apr. 16, 2021,
PCT Pub. No. WO2020/095454, PCT Pub. Date May 14, 2020.
Prior Publication US 2021/0370409 A1, Dec. 2, 2021
Int. Cl. B22F 12/90 (2021.01); B22F 12/57 (2021.01); B23K 26/03 (2006.01); B33Y 30/00 (2015.01)
CPC B22F 12/90 (2021.01) [B22F 12/57 (2021.01); B23K 26/032 (2013.01); B33Y 30/00 (2014.12)] 21 Claims
OG exemplary drawing
 
1. An additive manufacturing apparatus that performs an additive manufacturing process by supplying a fabrication material to a working position, melting the fabrication material, and depositing a fabrication material solidified after melting at the working position, while moving the working position of a workpiece, and forms a manufactured product by repeating the additive manufacturing process, the additive manufacturing apparatus comprising:
a height measurement circuit to perform measurement of a height of the manufactured product having already been formed on the workpiece at a measurement position during the additive manufacturing process, and output a measurement result representing a result of the measurement; and
a controller to control a machining condition to be used when new deposition is made at the measurement position, in accordance with the measurement result,
wherein the measurement position is moved according to movement of the working position and leads or trails the working position as the working position is moved, the measurement position being a position where the fabrication material has solidified, wherein
the height measurement circuit includes:
a measurement lighting device to apply illumination light for measurement to the measurement position; and
a light receiving optical system to receive reflected light of the illumination light for measurement on a light receiving element, the reflected light being reflected from the measurement position, and
the height measurement circuit computes the height of the manufactured product formed on the workpiece on the basis of a light reception position of the reflected light on the light receiving element.