US 12,246,378 B2
Metal solid production method
Kazuhiko Nishioka, Kawasaki (JP); and Koji Kageyama, Kawasaki (JP)
Assigned to K.K. SUN METALON, Kanagawa (JP)
Filed by K.K. SUN METALON, Kawasaki (JP)
Filed on Jan. 4, 2024, as Appl. No. 18/404,797.
Application 18/404,797 is a continuation of application No. 18/550,677, previously published as PCT/JP2022/011575, filed on Mar. 15, 2022.
Claims priority of application No. 2021-041553 (JP), filed on Mar. 15, 2021.
Prior Publication US 2024/0165706 A1, May 23, 2024
Int. Cl. B22F 10/22 (2021.01); B22F 1/12 (2022.01); B22F 3/00 (2021.01); B22F 3/14 (2006.01); B22F 3/16 (2006.01); B22F 3/24 (2006.01); B22F 5/00 (2006.01); B22F 7/02 (2006.01); B22F 9/20 (2006.01); B22F 10/10 (2021.01); B22F 10/20 (2021.01); B22F 10/25 (2021.01); B22F 10/66 (2021.01); B22F 12/41 (2021.01); B22F 12/50 (2021.01); B22F 12/60 (2021.01); B22F 12/70 (2021.01); B23K 1/005 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/10 (2020.01); B22F 3/105 (2006.01)
CPC B22F 10/22 (2021.01) [B22F 1/12 (2022.01); B22F 3/004 (2013.01); B22F 3/14 (2013.01); B22F 3/16 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); B22F 7/02 (2013.01); B22F 9/20 (2013.01); B22F 10/10 (2021.01); B22F 10/20 (2021.01); B22F 10/25 (2021.01); B22F 10/66 (2021.01); B22F 12/41 (2021.01); B22F 12/50 (2021.01); B22F 12/60 (2021.01); B22F 12/70 (2021.01); B23K 1/005 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/10 (2020.01); B22F 2003/1054 (2013.01); B22F 2201/01 (2013.01); B22F 2201/10 (2013.01); B22F 2201/50 (2013.01); B22F 2202/11 (2013.01); B22F 2301/052 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C04B 2237/34 (2013.01); C04B 2237/363 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A device for producing a metal solid, the device comprising:
a stage on which a layer of a metal powder and a layer of a high-melting-point solid covering at least a portion of a periphery of the layer of the metal powder and having a melting point higher than the melting point of the metal powder are placed;
a microwave irradiator configured to irradiate the metal powder, at least a portion of the periphery of which is covered with the high-melting-point solid, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder;
a high-melting-point solid placement unit configured to place the layer of the high-melting-point solid on the stage covering at least a portion of the periphery of the layer of the metal powder; and
a metal powder placement unit configured to place the layer of the metal powder in a recess of the layer of the high-melting-point solid,
wherein:
in the at least a portion of the periphery covered with the high-melting-point solid, the metal powder and the high-melting-point solid are in contact with each other; and
the high-melting-point solid includes a mixture of:
an insulation material that has a lower degree of absorption of the microwaves than the metal powder; and
an absorbent material that absorbs the microwaves in a temperature zone at least a portion of which is lower than a temperature zone in which the metal powder absorbs the microwaves.