| CPC B08B 1/12 (2024.01) [A46B 13/008 (2013.01); A46B 13/02 (2013.01); B08B 1/32 (2024.01); B08B 3/022 (2013.01); B08B 5/023 (2013.01); B08B 13/00 (2013.01); H01L 21/67046 (2013.01); A46B 2200/3073 (2013.01)] | 7 Claims |
|
1. A substrate cleaning method, comprising:
holding an outer peripheral end of a substrate with a first substrate holding part;
bringing a cleaning tool into contact with a lower surface of the substrate and cleaning the lower surface of the substrate;
rotating the cleaning tool around an axis in an up-down direction; and
moving the cleaning tool rotated around the axis in the up-down direction between a contact position where the cleaning tool comes into contact with the lower surface of the substrate held by the first substrate holding part and a separation position where the cleaning tool is separated from the lower surface of the substrate held by the first substrate holding part by a predetermined distance,
wherein rotating the cleaning tool around the axis in the up-down direction comprises
rotating the cleaning tool at a first rotation speed in response to the cleaning tool being at the separation position, and
rotating the cleaning tool at a second rotation speed that is higher than the first rotation speed at least one of a first time point and a second time point in a case where the first time point is a time point at which the cleaning tool in a state of being separated from the lower surface of the substrate comes into contact with the lower surface of the substrate in response to the cleaning tool moving from the separation position to the contact position, and the second time point is a time point at which the cleaning tool in a state of contacting the lower surface of the substrate is separated from the lower surface of the substrate in response to the cleaning tool moving from the contact position to the separation position.
|