US 11,925,120 B2
Spintronic devices with self-cooling function
Susumu Okamura, San Jose, CA (US); Christian Kaiser, San Jose, CA (US); Xinjiang Shen, Fremont, CA (US); Yongchul Ahn, San Jose, CA (US); and James Mac Freitag, Sunnyvale, CA (US)
Assigned to Western Digital Technologies, Inc., San Jose, CA (US)
Filed by Western Digital Technologies, Inc., San Jose, CA (US)
Filed on Jul. 28, 2021, as Appl. No. 17/387,270.
Prior Publication US 2023/0030248 A1, Feb. 2, 2023
Int. Cl. H10N 10/17 (2023.01); G01R 33/09 (2006.01); G11B 5/39 (2006.01); G11C 11/16 (2006.01); H10N 10/82 (2023.01); H10N 50/10 (2023.01); H10N 50/80 (2023.01); H10N 50/85 (2023.01)
CPC H10N 10/17 (2023.02) [G01R 33/093 (2013.01); G11B 5/3909 (2013.01); G11C 11/161 (2013.01); H10N 10/82 (2023.02); H10N 50/10 (2023.02); H10N 50/80 (2023.02); H10N 50/85 (2023.02)] 29 Claims
OG exemplary drawing
 
1. A device, comprising:
a spintronic device having a first side and a second side opposite the first side;
a first layer disposed on the first side; and
a second layer disposed on the second side, the first layer having a Seebeck coefficient that is different from a Seebeck coefficient of the second layer,
wherein the first layer is tapered such that a first surface of the first layer has a width that is shorter than a second width of a second surface of the first layer, the second surface opposite the first surface, and the first surface adjacent to the spintronic device, and
wherein the spintronic device is sandwiched between a bottom lead and a top lead.