US 11,924,998 B2
Hybrid immersion cooling system for rack-mounted electronic assemblies
Mohamad Hnayno, Roubaix (FR); Ali Chehade, Moncheaux (FR); and Henryk Klaba, Villeneuve d'Ascq (FR)
Assigned to OVH, Roubaix (FR)
Filed by OVH, Roubaix (FR)
Filed on Mar. 22, 2022, as Appl. No. 17/701,422.
Claims priority of application No. 21305427 (EP), filed on Apr. 1, 2021; and application No. 21306171 (EP), filed on Aug. 30, 2021.
Prior Publication US 2022/0322575 A1, Oct. 6, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20263 (2013.01) [H05K 7/20236 (2013.01); H05K 7/20772 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A hybrid liquid cooling system for at least one rack-mounted immersion case housed within a rack frame, comprising:
the at least one immersion case containing a volume of dielectric immersion cooling liquid and at least one electronic assembly submerged in the dielectric immersion cooling liquid, the at least one electronic assembly comprising one or more one heat-generating electronic processing components;
a closed-loop fluid distribution arrangement configured to circulate channelized fluid to and from fluidly-coupled elements associated with the at least one immersion case, the closed-loop fluid distribution arrangement comprising a tube channel network;
an external cooling module configured to thermally condition the channelized fluid circulated by the closed-loop fluid distribution arrangement in which the channelized fluid having a higher temperature is conditioned into channelized fluid having a lower temperature, the external cooling module comprising a fluidly-coupled input configured to receive the higher-temperature channelized fluid via the closed-loop fluid distribution arrangement and a fluidly-coupled output configured to forward the conditioned lower-temperature channelized fluid via the closed-loop fluid distribution arrangement;
a serpentine convection coil, comprising a plurality of helical coils, that is submerged in a vertical orientation within the dielectric immersion cooling liquid and separately disposed from the at least one electronic assembly, the vertically-oriented serpentine convection coil configured with a fluidly-coupled upper port and a fluidly-coupled lower port to fluidly communicate with the closed-loop fluid distribution arrangement, the vertically-oriented serpentine convection coil structured to internally convey the channelized fluid to operatively cool ambient temperatures of the dielectric immersion cooling liquid via thermal convection flow and the lower-temperature channelized fluid forwarded by the cooling module via the closed-loop fluid distribution arrangement; and
one or more fluid cooling blocks arranged to be in direct thermal contact with the one or more heat-generating electronic processing components, the one or more fluid cooling blocks fluidly-coupled to the closed-loop fluid distribution arrangement and configured to cool the one or more heat-generating electronic processing components based on the lower-temperature channelized fluid forwarded by the cooling module via the closed-loop fluid distribution arrangement.