US 11,924,980 B2
Method for manufacturing multilayer substrate and multilayer substrate
Yusuke Kamitsubo, Nagaokakyo (JP); and Tomohiro Furumura, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Jan. 14, 2022, as Appl. No. 17/575,717.
Application 17/575,717 is a continuation of application No. PCT/JP2020/030062, filed on Aug. 5, 2020.
Claims priority of application No. 2019-146236 (JP), filed on Aug. 8, 2019; and application No. 2020-063451 (JP), filed on Mar. 31, 2020.
Prior Publication US 2022/0141966 A1, May 5, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/4635 (2013.01) [H05K 1/0277 (2013.01); H05K 1/036 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09827 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A multilayer substrate comprising:
a first insulating resin base material layer and a second insulating resin base material layer each including different materials; wherein
the second insulating resin base material layer is stacked on the first insulating resin base material layer on which a conductor film is formed;
an adhesion strength between the first insulating resin base material layer and the conductor film is higher than an adhesion strength between the second insulating resin base material layer and the conductor film; and
a difference between a linear expansion coefficient of the conductor film and a linear expansion coefficient of the first insulating resin base material layer is larger than a difference between a linear expansion coefficient of the conductor film and a linear expansion coefficient of the second insulating resin base material layer.