US 11,924,979 B2
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
Masashi Okaniwa, Tokyo (JP); Takenori Takiguchi, Tokyo (JP); Kohei Higashiguchi, Tokyo (JP); and Tsuyoshi Kida, Tokyo (JP)
Assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
Appl. No. 17/049,224
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Apr. 24, 2019, PCT No. PCT/JP2019/017364
§ 371(c)(1), (2) Date Oct. 20, 2020,
PCT Pub. No. WO2019/208615, PCT Pub. Date Oct. 31, 2019.
Claims priority of application No. 2018-084967 (JP), filed on Apr. 26, 2018.
Prior Publication US 2021/0147629 A1, May 20, 2021
Int. Cl. C08K 5/29 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); C08F 222/40 (2006.01); C08G 73/10 (2006.01); C08K 3/36 (2006.01); C08K 5/14 (2006.01); C08L 79/08 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H05K 3/30 (2006.01)
CPC H05K 3/305 (2013.01) [B32B 27/281 (2013.01); B32B 27/36 (2013.01); C08F 222/40 (2013.01); C08F 222/404 (2020.02); C08G 73/1046 (2013.01); C08K 3/36 (2013.01); C08K 5/14 (2013.01); C08K 5/29 (2013.01); C08L 79/085 (2013.01); H01L 23/295 (2013.01); H01L 24/29 (2013.01); C08K 2201/003 (2013.01); C09J 2203/326 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2924/0635 (2013.01); H01L 2924/07025 (2013.01)] 26 Claims
 
1. A resin composition comprising:
a chelating flux agent (A);
a thermal radical polymerization initiator (B); and
a radical polymerizable compound (C);
wherein a content of the chelating flux agent (A) in the resin composition is 10 parts by mass or more and 50 parts by mass or less based on 100 parts by mass of a total amount of the radical polymerizable compound (C);
wherein the chelating flux agent (A) comprises a compound represented by the following formula (1):

OG Complex Work Unit Chemistry
wherein
Q is an arylene group, an alkylene group, an alkenylene group, a cycloalkylene group, a cycloalkenylene group, a heterocyclylene group or a heteroarylene group,
R1 and R2 are each independently a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group or a hexyl group,
R3 and R4 are each a 2-hydroxyphenyl group, and
for the arylene group, the alkylene group, the alkenylene group, the cycloalkylene group, the cycloalkenylene group, the heterocyclylene group, and the heteroarylene group, a hydrogen atom bonded to the group is optionally substituted with a hydroxy group or a mercapto group,
and/or an imine compound represented by the following formula (2):

OG Complex Work Unit Chemistry
wherein
R5 is a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group or a hexyl group,
R6 and R7 are each independently an alkyl group, a cycloalkyl group, an aryl group, a heteroaryl group or a heterocyclyl group, and
for the alkyl group, the cycloalkyl group, the aryl group, the heteroaryl group and the heterocyclyl group, a hydrogen atom bonded to the group is optionally substituted with a hydroxy group or a mercapto group; and
wherein the radical polymerizable compound (C) comprises:
a maleimide compound represented by the following formula (4):

OG Complex Work Unit Chemistry
wherein
an average value of n2 is 1 or more and 30 or less,
and at least one maleimide compound selected from the group consisting of:
2,2-bis(4-(4-maleimidophenoxy)phenyl)propane,
a maleimide compound represented by the following formula (3):

OG Complex Work Unit Chemistry
wherein
each R8 independently represents a hydrogen atom or a methyl group, and
n1 represents an integer of 1 or more, and
a maleimide compound represented by the following formula (5):

OG Complex Work Unit Chemistry
wherein
R9 and R10 each independently represent a hydrogen atom, a methyl group or an ethyl group, and
each R11 independently represents a hydrogen atom or a methyl group.