US 11,924,965 B2
Package component and forming method thereof
Chun-Wei Chang, Taoyuan County (TW); Jian-Hong Lin, Yunlin (TW); Shu-Yuan Ku, Taipei County (TW); Wei-Cheng Liu, Hsinchu County (TW); Yinlung Lu, Hsinchu (TW); and Jun He, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Apr. 25, 2022, as Appl. No. 17/728,758.
Prior Publication US 2023/0345622 A1, Oct. 26, 2023
Int. Cl. H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/42 (2006.01)
CPC H05K 1/0242 (2013.01) [H05K 1/0251 (2013.01); H05K 1/116 (2013.01); H05K 3/427 (2013.01); H05K 3/429 (2013.01); H05K 2201/0776 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package component, comprising:
a substrate comprising a first surface and a second surface opposite to the first surface; and
a first conductive layer over the first surface, the first conductive layer comprising:
a first conductive feature; and
a second conductive feature over the first conductive feature, wherein the second conductive feature covers a portion of the first conductive feature, and a resistance of the second conductive feature is lower than a resistance of the first conductive feature wherein a coverage ratio of the second conductive feature over the first conductive feature is substantially in a range from about 5% to about 95%.