US 11,924,599 B2
Headset and ear pad
Shinji Kuraoka, Fukuoka (JP); Reo Takiguchi, Fukuoka (JP); and Hirotaka Fukutsuka, Fukuoka (JP)
Assigned to Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed on Dec. 8, 2021, as Appl. No. 17/545,510.
Claims priority of application No. 2021-077917 (JP), filed on Apr. 30, 2021.
Prior Publication US 2022/0353596 A1, Nov. 3, 2022
Int. Cl. H04R 5/033 (2006.01); H04R 1/10 (2006.01); H04R 1/08 (2006.01)
CPC H04R 1/1008 (2013.01) [H04R 1/105 (2013.01); H04R 1/1058 (2013.01); H04R 1/08 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A headset comprising:
a housing provided at one end portion of a headband;
a boom main body attached to the housing; and
an ear pad attached to the housing on a side opposite to the boom main body,
wherein the ear pad comprises a cup portion configured to cover an entire auricle of a wearer when the entire auricle is inserted into an inner diameter portion of the cup portion, and
wherein in the cup portion, a plurality of through holes allowing the inner diameter portion to be open to an outside are formed closer to the housing than a cup opening of the inner diameter portion,
wherein the plurality of through holes are provided at equal intervals in a circumferential direction of the cup portion, and
wherein on an outer circumferential surface of the cup portion, ribs are radially formed around a bottom center of the cup portion, the ribs surrounding the plurality of through holes, respectively, and protruding from the outer circumferential surface.