US 11,924,557 B2
Pinhole camera, electronic apparatus and manufacturing method
Naoki Komai, Kanagawa (JP); and Takashi Sakairi, Kanagawa (JP)
Assigned to SONY CORPORATION, Tokyo (JP)
Filed by SONY CORPORATION, Tokyo (JP)
Filed on Mar. 26, 2021, as Appl. No. 17/213,624.
Application 17/213,624 is a continuation of application No. 15/745,028, granted, now 10,986,281, previously published as PCT/JP2016/070933, filed on Jul. 15, 2016.
Claims priority of application No. 2015-152905 (JP), filed on Jul. 31, 2015; and application No. 2015-242370 (JP), filed on Dec. 11, 2015.
Prior Publication US 2021/0218876 A1, Jul. 15, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H04N 23/74 (2023.01); G03B 19/16 (2021.01); H01L 27/14 (2006.01); H01L 27/146 (2006.01); H04N 23/55 (2023.01); H04N 23/56 (2023.01); H04N 23/75 (2023.01); H04N 25/70 (2023.01)
CPC H04N 23/74 (2023.01) [G03B 19/16 (2013.01); H01L 27/14 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/1463 (2013.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H04N 23/55 (2023.01); H04N 23/56 (2023.01); H04N 23/75 (2023.01); H04N 25/70 (2023.01); H01L 27/14627 (2013.01); H01L 27/14629 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor substrate;
a pixel array unit on the semiconductor substrate, wherein the pixel array unit includes a plurality of pixels;
a microlens layer on the semiconductor substrate;
a protective structure including a protective substrate on the semiconductor substrate;
a transparent seal resin between the microlens layer and the protective structure; and
a light shielding film on the protective structure, wherein
the light shielding film is configured to block light irradiated on the semiconductor substrate, and
the light shielding film includes a hole.