US 11,923,817 B2
Packaging surface acoustic wave devices with conductive terminals
Li Ann Koo, Singapore (SG); Takashi Inoue, Singapore (SG); Vivian Sing Zhi Lee, Singapore (SG); and Ping Yi Tan, Singapore (SG)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Jun. 30, 2021, as Appl. No. 17/364,242.
Application 17/364,242 is a continuation of application No. 16/555,985, filed on Aug. 29, 2019, granted, now 11,159,137.
Claims priority of provisional application 62/725,133, filed on Aug. 30, 2018.
Prior Publication US 2022/0006439 A1, Jan. 6, 2022
Int. Cl. H03H 3/08 (2006.01); B23K 26/362 (2014.01); H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01)
CPC H03H 3/08 (2013.01) [B23K 26/362 (2013.01); H03H 9/02559 (2013.01); H03H 9/02622 (2013.01); H03H 9/059 (2013.01); H03H 9/1064 (2013.01); H03H 9/1092 (2013.01); H03H 9/25 (2013.01); G01N 2291/0423 (2013.01); H01L 2224/16 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged acoustic wave device comprising:
a seed layer over at least a portion of a roof of an interdigital transducer electrode cavity structure;
a conductive structure located over at least a portion of the seed layer;
a photosensitive resin layer over at least a portion of the conductive structure, the photosensitive resin layer having at least one aperture formed therein, the photosensitive resin layer having a sidewall portion, at least a portion of the conductive structure disposed between a sidewall of the interdigital transducer electrode cavity structure and the sidewall portion of the photosensitive resin layer; and
a conductive terminal in contact with the conductive structure, at least a portion of the conductive terminal extending through the at least one aperture in the photosensitive resin layer.