US 11,923,598 B2
Scalable high-bandwidth connectivity
Gary D McCormack, Tigard, OR (US); and Ian A. Kyles, West Linn, OR (US)
Assigned to Molex, LLC, Lisle, IL (US)
Filed by Molex, LLC, Lisle, IL (US)
Filed on Dec. 22, 2021, as Appl. No. 17/558,883.
Application 17/558,883 is a continuation of application No. 16/790,662, filed on Feb. 13, 2020, abandoned.
Application 16/790,662 is a continuation of application No. 15/448,239, filed on Mar. 2, 2017, granted, now 10,601,105, issued on Mar. 4, 2020.
Application 15/448,239 is a continuation of application No. 13/471,058, filed on May 14, 2012, granted, now 9,614,590, issued on Apr. 4, 2017.
Claims priority of provisional application 61/535,277, filed on Sep. 15, 2011.
Claims priority of provisional application 61/485,543, filed on May 12, 2011.
Prior Publication US 2022/0115764 A1, Apr. 14, 2022
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 1/52 (2006.01); H01Q 5/25 (2015.01); H04B 5/00 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/48 (2013.01); H01Q 1/525 (2013.01); H01Q 5/25 (2015.01); H04B 5/0037 (2013.01); H04B 5/0081 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A device, comprising:
a dielectric substrate having a major surface, the major surface aligning with and parallel to a major surface of a second substrate;
a plurality of chips arranged on the major surface of the dielectric substrate, comprising a plurality of Extremely High Frequency (EHF) communication units,
wherein each of the plurality of EHF communication units comprises an antenna and is configured to transmit and/or receive respective EHF electromagnetic signals in a first direction away from the major surface of the dielectric substrate,
wherein each of the plurality of EHF communication units is configured to establish a respective communication channel oriented in the first direction with a corresponding EHF communication unit of a second plurality of EHF communication units disposed at a corresponding location of the major surface of the second substrate,
wherein the substrate and the second substrate are separated by an intervening layer; and
wherein the intervening layer comprises a conductive material and includes a window configured to allow transmission of EHF communications signals corresponding to a communication channel of the respective communication channels through the window.