US 11,923,472 B2
Deformable array of semiconductor devices
Sabrina M. Curtis, Silver Spring, MD (US); Haotian Wang, Greenbelt, MD (US); Gabriel P. Anfinrud, Rockville, MD (US); Alexander O. Randolph, Madison, WI (US); Gabriel L. Smith, Ellicot City, MD (US); and Nathan S. Lazarus, Bethesda, MD (US)
Assigned to The United States of America as represented by the Secretary of the Army, Washington, DC (US)
Filed by CCDC Army Research Laboratory, Adelphi, MD (US)
Filed on Oct. 30, 2019, as Appl. No. 16/668,715.
Claims priority of provisional application 62/755,663, filed on Nov. 5, 2018.
Prior Publication US 2020/0144431 A1, May 7, 2020
Int. Cl. H01L 31/05 (2014.01); H01L 31/0352 (2006.01); H01L 31/18 (2006.01)
CPC H01L 31/05 (2013.01) [H01L 31/035281 (2013.01); H01L 31/1804 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A deformable array of semiconductor devices comprising:
a plurality of triangular islands, where each triangular island comprises at least one semiconductor device and the plurality of triangular islands are arranged in an auxetic geometry so that the array exhibits a negative Poisson's ratio when loaded under tensile strain; and
a plurality of serpentine interconnects coupling the plurality of triangular islands to one another, each having a first end which connects to one triangular island and a second end which connects to an adjacent triangular island and a plurality of bends therebetween,
wherein the triangular islands and the serpentine interconnects lie in the same plane in an unstretched condition, and
wherein, in the unstretched condition, each serpentine interconnect couples, at its first end, to the one triangular island near one corner of the one triangular island, extends in a direction toward another corner of the one triangular island, bends in the same plane to extend in the opposite direction to back towards the one corner of the one triangular island, at least twice, and couples, at its second end, to the adjacent triangular island.