CPC H01L 29/0653 (2013.01) [H01L 29/0673 (2013.01); H01L 29/0847 (2013.01); H01L 29/1037 (2013.01); H01L 29/205 (2013.01); H01L 29/42392 (2013.01); H01L 29/785 (2013.01)] | 23 Claims |
1. An integrated circuit comprising:
a body of semiconductor material, the body having a bottommost surface;
a gate structure in contact with a portion of the body, the gate structure defining a channel region in the body;
a source region in contact with the body;
a drain region in contact with the body such that the portion of the body in contact with the gate structure is between the source region and the drain region;
a first isolation region under an entirety of the source region and having a top surface in contact with an entirety of a bottom surface of the source region laterally adjacent to the channel region, the first isolation region having an uppermost surface above the bottommost surface of the body, and the first isolation region having a bottommost surface below the bottommost surface of the body, wherein the body is not vertically intervening between the first isolation region and the source region; and
a second isolation region under an entirety of the drain region and having a top surface in contact with an entirety of a bottom surface of the drain region laterally adjacent to the channel region, the second isolation region having an uppermost surface above the bottommost surface of the body, and the second isolation region having a bottommost surface below the bottommost surface of the body, wherein the body is not vertically intervening between the second isolation region and the drain region.
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