US 11,923,340 B2
Semiconductor package including mold layer and manufacturing method thereof
Yeongkwon Ko, Hwaseong-si (KR); Jinwoo Park, Seoul (KR); Jaekyung Yoo, Seoul (KR); and Teakhoon Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 18, 2021, as Appl. No. 17/405,130.
Claims priority of application No. 10-2021-0033326 (KR), filed on Mar. 15, 2021.
Prior Publication US 2022/0293563 A1, Sep. 15, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 21/561 (2013.01); H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/17 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/18 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92143 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06586 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a package substrate;
a base chip disposed on the package substrate;
a first semiconductor chip disposed on the base chip;
a second semiconductor chip disposed on the first semiconductor chip;
an inner mold layer surrounding an upper surface of the base chip and respective side surfaces of the first semiconductor chip and the second semiconductor chip;
a first outer mold layer interposed between the package substrate and the base chip while covering at least a portion of a side surface of the base chip; and
a second outer mold layer disposed on the first outer mold layer while covering at least a portion of a side surface of the inner mold layer, the second outer mold layer being spaced apart from the package substrate,
wherein the first outer mold layer and the second outer mold layer have different viscosities, respectively,
wherein an under surface of the first outer mold layer is in contact with the package substrate,
wherein an upper surface of the first outer mold layer is in contact with an under surface of the second outer mold layer,
wherein an outer surface of the first outer mold layer extends from the upper surface of the first outer mold layer to the under surface of the first outer mold layer,
wherein the upper surface of the first outer mold layer and the under surface of the second outer mold layer are flat, and
wherein the upper surface of the first outer mold layer is in contact with the under surface of the second outer mold layer.