US 11,923,312 B2
Patternable die attach materials and processes for patterning
Bai Nie, Chandler, AZ (US); Gang Duan, Chandler, AZ (US); Srinivas Pietambaram, Chandler, AZ (US); Jesse Jones, Chandler, AZ (US); Yosuke Kanaoka, Chandler, AZ (US); Hongxia Feng, Chandler, AZ (US); Dingying Xu, Chandler, AZ (US); Rahul Manepalli, Chandler, AZ (US); Sameer Paital, Chandler, AZ (US); Kristof Darmawikarta, Chandler, AZ (US); Yonggang Li, Chandler, AZ (US); Meizi Jiao, Chandler, AZ (US); Chong Zhang, Chandler, AZ (US); Matthew Tingey, Hillsboro, OR (US); Jung Kyu Han, Chandler, AZ (US); and Haobo Chen, Gilbert, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 27, 2019, as Appl. No. 16/366,661.
Prior Publication US 2020/0312771 A1, Oct. 1, 2020
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/214 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/381 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A die assembly, comprising:
a die;
one or more die pads on a first surface of the die; and
a die attach film on the first surface of the die but not along sides of the die, wherein the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die, the one or more openings exposing sidewalls of the one or more die pads, and wherein the die attach film has an uppermost surface above an uppermost surface of the one or more die pads.