US 11,923,281 B2
Semiconductor package with isolated heat spreader
Anindya Poddar, Sunnyvale, CA (US); Woochan Kim, San Jose, CA (US); and Vivek Kishorechand Arora, San Jose, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Apr. 12, 2022, as Appl. No. 17/719,246.
Application 17/719,246 is a continuation of application No. 16/840,407, filed on Apr. 5, 2020, granted, now 11,302,615.
Claims priority of provisional application 62/955,206, filed on Dec. 30, 2019.
Prior Publication US 2022/0238424 A1, Jul. 28, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4882 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 24/05 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01); H01L 25/16 (2013.01); H01L 2924/1304 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a metallic pad, a first set of leads and a second set of leads;
a first semiconductor die and a second semiconductor die attached to the metallic pad, the first semiconductor die electrically connected to the first set of leads and the second semiconductor die electrically connected to the second set of leads, and the first semiconductor die electrically connected to the second semiconductor die, wherein the first semiconductor die is configured to control switching of transistors in the second semiconductor die;
a heat spreader attached to the second semiconductor die via an electrically insulating material, wherein the heat spreader includes an exposed pad and a protrusion extending from the exposed pad;
a mold compound covering portions of the first semiconductor die, the second semiconductor die, the metallic pad, and the heat spreader.