US 11,923,279 B2
Semiconductor device
Nobutoshi Fujii, Kanagawa (JP); and Yoshihisa Kagawa, Kanagawa (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Filed by Sony Group Corporation, Tokyo (JP)
Filed on Dec. 7, 2022, as Appl. No. 18/076,861.
Application 18/076,861 is a continuation of application No. 17/675,902, filed on Feb. 18, 2022, granted, now 11,626,356.
Application 17/675,902 is a continuation of application No. 15/945,579, filed on Apr. 4, 2018, granted, now 11,587,857.
Application 15/945,579 is a continuation of application No. 15/711,607, filed on Sep. 21, 2017, granted, now 10,236,238, issued on Mar. 19, 2019.
Application 15/711,607 is a continuation of application No. 14/116,432, granted, now 9,799,587, issued on Oct. 24, 2017, previously published as PCT/JP2012/062484, filed on May 16, 2012.
Claims priority of application No. 2011-115634 (JP), filed on May 24, 2011; and application No. 2011-129190 (JP), filed on Jun. 9, 2011.
Prior Publication US 2023/0098931 A1, Mar. 30, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 27/146 (2006.01)
CPC H01L 23/498 (2013.01) [H01L 23/49866 (2013.01); H01L 23/522 (2013.01); H01L 23/53238 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/09 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/1464 (2013.01); H01L 24/80 (2013.01); H01L 2224/05547 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/06133 (2013.01); H01L 2224/0616 (2013.01); H01L 2224/06517 (2013.01); H01L 2224/08123 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/09517 (2013.01); H01L 2224/80194 (2013.01); H01L 2224/80357 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13091 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first section including a first electrode extending in a first direction; and
a second section including a second electrode and disposed to be bonded to the first section at a bonding interface, the second electrode being bonded to the first electrode at the bonding interface and extending in a second direction that intersects with the first direction.