US 11,923,269 B2
Co-packaged optical module
Mark D. Schultz, Ossining, NY (US); Fuad Elias Doany, Katonah, NY (US); Benjamin Giles Lee, Ridgefield, CT (US); Daniel M. Kuchta, Patterson, NY (US); and Christian Wilhelmus Baks, Pleasant Valley, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Apr. 7, 2021, as Appl. No. 17/225,075.
Prior Publication US 2022/0328375 A1, Oct. 13, 2022
Int. Cl. H01L 23/367 (2006.01); G02B 6/42 (2006.01); H01L 25/16 (2023.01); H01L 23/498 (2006.01)
CPC H01L 23/3675 (2013.01) [G02B 6/4269 (2013.01); H01L 25/167 (2013.01); H01L 23/49833 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An optical module for converting communication between optical signals and electrical signals, the optical module comprising:
an optoelectronic assembly comprising:
a flat, rigid substrate;
an array of electrical contacts positioned on a first portion of the substrate; and
an optoelectronics assemblage that is electrically connected to the array of contacts and is at least partially positioned apart from the array of electrical contacts, wherein the optoelectronics assemblage comprises an integrated circuit and a lens configured for optical communications; and
a heat spreader comprised of a thermally conductive material, the heat spreader comprising:
a second portion that is structurally connected to the first portion; and
a third portion that is thermally connected to the optoelectronics assemblage;
wherein the substrate passes through an aperture in the heat spreader.