US 11,923,268 B2
Printed heat spreader structures and methods of providing same
Jesus Gerardo Reyes Schuldes, Chandler, AZ (US); Shankar Devasenathipathy, Tempe, AZ (US); Pramod Malatkar, Chandler, AZ (US); Aravindha Antoniswamy, Phoenix, AZ (US); and Kyle Arrington, Gilbert, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Feb. 4, 2020, as Appl. No. 16/781,475.
Prior Publication US 2021/0242105 A1, Aug. 5, 2021
Int. Cl. H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 21/4814 (2013.01); H01L 23/373 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H05K 1/0204 (2013.01); H01L 2224/16 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1532 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device assembly, comprising:
a substrate;
an integrated circuit (IC) die over a surface of the substrate; and
a heat spreader structure comprising a stack of material layers including:
a first material layer which extends over the IC die; and
a second material layer in direct contact with the first material layer, wherein the first material layer and the second material layer have substantially a same composition;
wherein one or more pores are formed in the heat spreader structure.