US 11,923,264 B2
Semiconductor apparatus for discharging heat
Yongha Kim, Seongnam-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 25, 2020, as Appl. No. 17/002,096.
Claims priority of application No. 10-2019-0116366 (KR), filed on Sep. 20, 2019; and application No. 10-2020-0027214 (KR), filed on Mar. 4, 2020.
Prior Publication US 2021/0090968 A1, Mar. 25, 2021
Int. Cl. H01L 23/34 (2006.01); C09J 9/02 (2006.01); H01L 23/373 (2006.01); H01L 23/482 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/34 (2013.01) [C09J 9/02 (2013.01); H01L 23/3733 (2013.01); H01L 23/3735 (2013.01); H01L 23/4828 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/314 (2020.08); H01L 23/5387 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor apparatus comprising:
a system substrate;
a semiconductor package mounted on the system substrate and having a first length in a first horizontal direction;
a conductive label that is flexible and arranged on the semiconductor package, the conductive label comprising: a first adhesive layer contacting the semiconductor package; a thermally-conductive layer, which is attached to the semiconductor package by the first adhesive layer and has a second length in the first horizontal direction greater than the first length of the semiconductor package; and a second adhesive layer contacting, from among a surface of the thermally-conductive layer, only a portion of the surface of the thermally-conductive layer wherein the portion is less than an entirety of the surface of the thermally-conductive layer, the portion not vertically overlapping the semiconductor package;
a thermal interface material arranged on the thermally-conductive layer to vertically overlap the semiconductor package; and
a cover comprising: a first cover portion vertically overlapping the semiconductor package and contacting the thermal interface material; and a second cover portion to which the thermally-conductive layer is attached by the second adhesive layer.