CPC H01L 21/7624 (2013.01) [H01L 21/02238 (2013.01); H01L 21/02255 (2013.01); H01L 23/3171 (2013.01); H01L 21/02164 (2013.01); H01L 21/02172 (2013.01); H01L 21/02271 (2013.01); H01L 21/0228 (2013.01)] | 19 Claims |
1. A semiconductor structure comprising a silicon-on-insulator layer structure with crystalline silicon oxide as the insulator material, comprising:
a crystalline silicon base layer;
a crystalline silicon oxide layer, with a thickness of at least two molecular layers, on the crystalline silicon base layer at a first interface; and
a crystalline silicon top layer on the crystalline silicon oxide layer at a second interface, wherein the first interface and the second interface are graded with oxygen.
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